Microprocessing (groove, cut, drill, micromill, etc.) with our ps-lasers is

precise

• no thermal side-effects such as microcracks, burrs, or recast
• lateral resolution as small as a few µm
• depth control in the order of 10nm

versatile

• virtually any material
• simple, flexible software commands; CAD input
• pulses-on-demand for easy integration into delivery systems

cost efficient

• high throughput due to high pulse repetition rates
• industrial reliability
• low cost of ownership

Whenever value creation depends on high quality structuring of surfaces or thin materials, ps-laser microprocessing is likely the superior choice.